Optoisolator leadframe assembly

ABSTRACT

An optoisolator leadframe assembly includes: an emitter leadframe part including a first rail and a plurality of emitter leadframe units, each rail including two rows of emitter leadframes, each having a die-mounting pad; and a receiver leadframe part including a second rail and a plurality of receiver leadframe units, each including two rows of receiver leadframes, each having a die-mounting pad. The die-mounting pads of the emitter leadframes of each row of each of the emitter leadframe units are respectively aligned with and spaced apart from the die-mounting pads of the receiver leadframes of an adjacent row of an adjacent one of the receiver leadframe units. Each of the emitter and receiver leadframe parts is a single piece.

REFERENCE TO RELATED APPLICATION

This Application is being filed as a Continuation application Ser. No.12/153,543, filed 21 May 2008, currently pending.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority of China application no.200710032617.1, filed on Dec. 13, 2007.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to an optoisolator leadframe assembly, moreparticularly to an optoisolator leadframe assembly including two alignedsingle pieces of emitter and receiver leadframe parts, each of whichincludes a rail and a plurality of leadframe units.

2. Description of the Related Art

U.S. Pat. No. 4,633,582 discloses a conventional optoisolator leadframeassembly (see FIG. 1) that is made from a single piece of a stampedmetal sheet 9 including first and second rails 91, 92 that are coplanar,and emitter and receiver leadframe units 93, 94 extending between thefirst and second rails 91, 92 and including emitter and receiverleadframes 901, 902, respectively. Each of the emitter and receiverleadframes 901, 902 has a die-mounting pad 903 (904) for receiving oneof a light emitting chip and a light detector (not shown), and aplurality of leads 905 (906). The die-mounting pad 903 of each of theemitter leadframes 901 is aligned with the die-mounting pad 904 of acorresponding one of the receiver leadframes 902. The aforesaidconventional optoisolator leadframe assembly is disadvantageous in thatan additional apparatus is required to conduct twisting action of theemitter leadframe unit 93 so as to permit alignment of the die-mountingpads 903, 904 of an adjacent pair of the emitter and receiver leadframes901, 902.

Taiwanese Laid Open publication No. 200743201 discloses anotherconventional optoisolator leadframe assembly (see FIG. 2) that includesfirst and second rails 81, 82 that are coplanar, a plurality of emitterleadframe units 83 extending between the first and second rails 81, 82,and a plurality of receiver leadframe units 84 disposed alternately withthe emitter leadframe units 83. Each of the emitter and receiverleadframe units 83, 84 has a die-mounting pad 801 (802) and a pair ofleads 803 (804). The first and second rails 81, 82 and the emitterleadframe units 83 are a single piece of a stamped metal sheet. Each ofthe receiver leadframe units 84 is cut and removed from the single pieceof the stamped metal sheet, and is then reversed and repositionedaccurately between an adjacent pair of the emitter leadframe units 83,which requires an additional apparatus to conduct the reversing andrepositioning actions, which, in turn, results in an increase in themanufacturing costs.

SUMMARY OF THE INVENTION

Therefore, an object of the present invention is to provide anoptoisolator leadframe assembly that can overcome the aforesaiddrawbacks associated with the prior art.

According to this invention, an optoisolator leadframe assemblycomprises: an emitter leadframe part including a first rail extending ina first direction, and a plurality of spaced apart emitter leadframeunits aligned in the first direction, each of the emitter leadframeunits extending from the first rail in a second direction perpendicularto the first direction, and including at least one row of emitterleadframes, the emitter leadframes of each of the emitter leadframeunits being aligned in the second direction, each of the emitterleadframes having a die-mounting pad and a pair of leads; and a receiverleadframe part including a second rail parallel to the first rail, and aplurality of spaced apart receiver leadframe units aligned in the firstdirection and disposed alternately with the emitter leadframe units.Each of the receiver leadframe units extends from the second rail in thesecond direction, and includes at least one row of receiver leadframes.The receiver leadframes of each of the receiver leadframe units isaligned in the second direction. Each of the receiver leadframes has adie-mounting pad and a pair of leads. The die-mounting pads of theemitter leadframes of each of the emitter leadframe units arerespectively aligned with and spaced apart from the die-mounting pads ofthe receiver leadframes of an adjacent one of the receiver leadframeunits in a third direction perpendicular to the first and seconddirections. Each of the emitter and receiver leadframe parts is a singlepiece. Each of the emitter leadframe units further includes a free endportion that is connected to an endmost one of the emitter leadframesand that is in contact with the second rail. Each of the receiverleadframe units further includes a free end portion that is connected toan endmost one of the receiver leadframes and that is in contact withthe first rail.

The free end portion of each of the emitter leadframe units is anchoredon the second rail, and the first rail seated on the free end portionsof the receiver leadframe units.

The first and second rails are non-coplanar.

Each of the emitter leadframe units further includes a first stern thatis connected to the other endmost one of the emitter leadframes, andthat cooperates with the first rail to define a first step therebetween.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will becomeapparent in the following detailed description of the preferredembodiments of the invention, with reference to the accompanyingdrawings, in which:

FIG. 1 is a fragmentary perspective view of a conventional optoisolatorleadframe assembly;

FIG. 2 is a fragmentary schematic view of another conventionaloptoisolator leadframe assembly;

FIG. 3 is a fragmentary perspective view of the first preferredembodiment of an optoisolator leadframe assembly according to thisinvention;

FIG. 3A is an expanded view of FIG. 3;

FIG. 4 is a fragmentary perspective view illustrating configurations oftwo single pieces cut from a stamped metal sheet for making the firstpreferred embodiment;

FIG. 4A is an expanded view of FIG. 4;

FIG. 5 is a fragmentary schematic view illustrating the configurationsof the two single pieces of FIG. 4 in a separated state;

FIG. 6 is a fragmentary perspective view illustrating how the two singlepieces of

FIG. 4 are aligned and assembled into the optoisolator leadframeassembly of FIG. 3;

FIG. 7 is a fragmentary schematic view of the second preferredembodiment of the optoisolator leadframe assembly according to thisinvention; and

FIG. 8 is a fragmentary schematic view of the third preferred embodimentof the optoisolator leadframe assembly according to this invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Before the present invention is described in greater detail withreference to the accompanying preferred embodiments, it should be notedherein that like elements are denoted by the same reference numeralsthroughout the disclosure.

FIGS. 3 and 3A illustrate the first preferred embodiment of anoptoisolator leadframe assembly according to the present invention. Theoptoisolator leadframe assembly includes: an emitter leadframe part 300including a first rail 21 extending in a first direction (X), and aplurality of spaced apart emitter leadframe units 3 aligned in the firstdirection (X), each of the emitter leadframe units 3 extending from thefirst rail 21 in a second direction (Y) perpendicular to the firstdirection (X), and including two rows 33 of emitter leadframes 34 thatare symmetrically disposed (see FIG. 5), each one of the two rows 33 ofthe emitter leadframes 34 being aligned in the second direction (Y),each of the emitter leadframes 34 having a die-mounting pad 341 and apair of leads 342; and a receiver leadframe part 400 including a secondrail 22 parallel to the first rail 21, and a plurality of spaced isapart receiver leadframe units 4 aligned in the first direction (X) anddisposed alternately with the emitter leadframe units 3. Each of thereceiver leadframe units 4 extends from the second rail 22 in the seconddirection (Y), and includes two rows 43 of receiver leadframes 44 thatare symmetrically disposed (see FIG. 5). Each one of the two rows 43 ofthe receiver leadframes 44 is aligned in the second direction (Y). Eachof the receiver leadframes 44 has a die-mounting pad 441 and a pair ofleads 442. The die-mounting pad 341 of the emitter leadframes 34 of eachof the two rows 33 of each of the emitter leadframe units 3 arerespectively aligned with and spaced apart from the die-mounting pads441 of the receiver leadframes 44 of an adjacent one of the two rows 43of an adjacent one of the receiver leadframe units 4 in a thirddirection (Z) perpendicular to the first and second directions (X, Y).The first and second rails 21, 22 are non-coplanar, i.e., the first andsecond rails 21, 22 do not lie in the same plane.

Each of the emitter and receiver leadframe parts 300, 400 is made from asingle piece of a stamped metal sheet. During stamping operation, afirst cutting slit 30 (see FIGS. 4 and 4A) is formed between the secondrail 22 and each of the emitter leadframe units 3, and a second cuttingslit 40 (see FIGS. 4 and 4A) is formed between the first rail 21 andeach of the receiver leadframe units 4 on the stamped metal sheet,thereby permitting separation of the emitter and receiver leadframeparts 300, 400 (see FIG. 5). The emitter and receiver leadframe parts300, 400 are subsequently aligned (see FIG. 6) and assembled into theconfiguration shown in FIGS. 3 and 3A.

Referring to FIGS. 3 and 5, in this embodiment, each of the emitterleadframe units 3 further includes a first stem 36 that is connected toan endmost one of the emitter leadframes 34 of each of the two rows 33of the emitter leadframe unit 3, and that cooperates with the first rail21 to define a first step 37 therebetween. Each of the emitter leadframeunits 3 further includes a free end portion 32 that is connected to theother endmost one of the emitter leadframes 34, and that is in contactwith and is preferably anchored on the second rail 22. Each of thereceiver leadframe units 4 further includes a second stem 46 that isconnected to an endmost one of the receiver leadframes 44 of each of thetwo rows 43 of the receiver leadframe unit 4, and a free end portion 42that is connected to the other endmost one of the receiver leadframes 44and that is in contact with the first rails 21. The first rail 21 ispreferably seated on the free end portions 42 of the receiver leadframeunits 4.

Referring now to FIG. 6, in combination with FIGS. 3 and 5, each of theemitter leadframe units 3 further includes a pair of prongs 35, each ofwhich is disposed between and is connected to the free end portion 32and the other endmost one of the emitter leadframes 34 of a respectiveone of the two rows 33 of the emitter leadframe unit 3 and each of whichcooperates with the free end portion 32 to define a second step 38therebetween. The first and second steps 37, 38 of each of the emitterleadframe units 3 have the same level so as to permit the first rail 21and the free end portions 32 of the emitter leadframe units 3 to becoplanar. The second rail 22 is formed with a pair of retaining notches45 between each two adjacent ones of the receiver leadframe units 4 forreceiving the prongs 35 of a respective one of the emitter leadframeunits 3 therein, respectively.

In this embodiment, each of the emitter leadframe units 3 furtherincludes a central beam 31 (see FIG. 5) disposed between the two rows 33of the emitter leadframes 34 and connected to the leads 342 of theemitter leadframes 34 of the two rows 33 of the emitter leadframe unit3. The central beam 31 of each of the emitter leadframe units 3 isformed with a slit 310 for facilitating subsequent cutting operation.Each of the receiver leadframe units 4 further includes a central beam41 disposed between the two rows 43 of the receiver leadframes 44 andconnected to the leads 442 of the receiver leadframes 44 of the two rows43 of the receiver leadframe unit 4.

FIG. 7 illustrates the second preferred embodiment of the optoisolatorleadframe assembly according to this invention. The second preferredembodiment differs from is the previous embodiment in that the centralbeam 41 of each of the receiver leadframe units 4 is also formed with aslit 410 for facilitating subsequent cutting operation.

FIG. 8 illustrates the third preferred embodiment of the optoisolatorleadframe assembly according to this invention. The third preferredembodiment differs from the previous embodiments in that the centralbeams 31, 41 of the emitter and receiver leadframe units 3, 4 aredispensed with, that the leads 342 of the emitter leadframes 34 of oneof the two rows 33 of each of the emitter leadframe units 3 are disposedalternately with the leads 342 of the emitter leadframes 34 of the otherof the two rows 33 of the emitter leadframe unit 3, and that the leads442 of the receiver leadframes 44 of one of the two rows 43 of each ofthe receiver leadframe units 4 are disposed alternately with the leads442 of the receiver leadframes 44 of the other of the two rows 43 of thereceiver leadframe unit 4.

With the design of the emitter and receiver leadframe parts 300, 400 ofthe optoisolator leadframe assembly of this invention, alignment andassembly of the emitter and receiver leadframe parts 300, 400 can beconducted using the same apparatus used to form and process the stampedmetal sheet, thereby eliminating the aforesaid drawbacks associated withthe prior art.

While the present invention has been described in connection with whatare considered the most practical and preferred embodiments, it isunderstood that this invention is not limited to the disclosedembodiments but is intended to cover various arrangements includedwithin the spirit and scope of the broadest interpretations andequivalent arrangements.

What is claimed is:
 1. An optoisolator leadframe assembly comprising: anintegrally formed emitter leadframe part including: a plurality ofspaced apart emitter leadframe units aligned in a first direction, eachof said emitter leadframe units extending in a second directionperpendicular to the first direction and including a pair of rows ofemitter leadframes, said emitter leadframes of said rows of each of saidemitter leadframe units being interconnected in series along the seconddirection and being aligned in the second direction, each of saidemitter leadframes having a die-mounting pad and a pair of leads thatare electrically connected to said die-mounting pad, said leads of saidemitter leadframes of one of said rows of each of said emitter leadframeunits extending from said die-mounting pad connected thereto toward saidleads of said emitter leadframes of the other of said rows of each ofsaid emitter leadframe units; and an integrally formed receiverleadframe part including: a plurality of spaced apart receiver leadframeunits aligned in the first direction and disposed alternately with saidemitter leadframe units, each of said receiver leadframe units extendingin the second direction, and including a pair of rows of receiverleadframes, said receiver leadframes of said rows of each of saidreceiver leadframe units being interconnected in series along the seconddirection and being aligned in the second direction, each of saidreceiver leadframes having a die-mounting pad and a pair of leads thatare electrically connected to said die-mounting pad, said leads of saidreceive leadframes of one of said rows of each of said receive leadframeunits extending from said die-mounting pad connected thereto toward saidleads of said receive leadframes of the other of said rows of each ofsaid receive leadframe units, wherein said die-mounting pads of saidemitter leadframes of each of said emitter leadframe units arerespectively aligned with and spaced apart from said die-mounting padsof said receiver leadframes of an adjacent one of said receiverleadframe units in the second direction.
 2. The optoisolator leadframeassembly of claim 1, wherein each of said emitter leadframe unitsfurther includes at least one beam connected to said pair of rows ofsaid emitter leadframes.
 3. The optoisolator leadframe assembly of claim2, wherein each of said emitter leadframe units includes a central beamdisposed between said pair of rows of said emitter leadframes andconnected to said leads of said emitter leadframes.
 4. The optoisolatorleadframe assembly of claim 3, wherein said emitter leadframes of saidpair of rows of each of said emitter leadframe units connected to saidcentral beam are disposed symmetrically.
 5. The optoisolator leadframeassembly of claim 2, wherein each of said emitter leadframe unitsincludes a pair of beams that are respectively disposed between saidmounting pads and said leads of said emitter leadframes of said rows ofsaid emitter leadframes, said leads of said emitter leadframes of theone of said rows of said emitter leadframes disposed alternately withsaid leads of said emitter leadframes of the other of said rows of saidemitter leadframes.
 6. The optoisolator leadframe assembly of claim 1,wherein each of said receiver leadframe units further includes at leastone beam connected to said two rows of said receiver leadframes.
 7. Theoptoisolator leadframe assembly of claim 6, wherein each of saidreceiver leadframe units includes a central beam disposed between saidtwo rows of said receiver leadframes and connected to said leads of saidreceiver leadframes.
 8. The optoisolator leadframe assembly of claim 7,wherein said emitter leadframes of said two rows of each of saidreceiver leadframe units connected to said central beam are disposedsymmetrically.
 9. The optoisolator leadframe assembly of claim 2,wherein each of said receiver leadframe units includes a pair of beamsthat are respectively disposed between said mounting pads and said leadsof said receiver leadframes of said rows of said receiver leadframes,said leads of said receiver leadframes of the one of said rows of saidreceiver leadframes disposed alternately with said leads of saidreceiver leadframes of the other of said rows of said receiverleadframes.
 10. An optoisolator leadframe assembly comprising: anintegrally formed emitter leadframe part including: a first railextending in a first direction, and a plurality of spaced apart emitterleadframe units aligned in the first direction, each of said emitterleadframe units extending from said first rail in a second directionperpendicular to the first direction and including a pair of rows ofemitter leadframes, said emitter leadframes of said rows of each of saidemitter leadframe units being interconnected in series along the seconddirection and being aligned in the second direction, each of saidemitter leadframes having a die-mounting pad and a pair of leads thatare electrically connected to said die-mounting pad, said leads of saidemitter leadframes of one of said rows of each of said emitter leadframeunits extending from said die-mounting pad connected thereto toward saidleads of said emitter leadframes of the other of said rows of each ofsaid emitter leadframe units; and an integrally formed receiverleadframe part including: a second rail parallel to said first rail, anda plurality of spaced apart receiver leadframe units aligned in thefirst direction and disposed alternately with said emitter leadframeunits, each of said receiver leadframe units extending from said secondrail in the second direction, and including a pair of rows of receiverleadframes, said receiver leadframes of said rows of each of saidreceiver leadframe units being interconnected in series along the seconddirection and being aligned in the second direction, each of saidreceiver leadframes having a die-mounting pad and a pair of leads thatare electrically connected to said die-mounting pad, said leads of saidreceive leadframes of one of said rows of each of said receive leadframeunits extending from said die-mounting pad connected thereto toward saidleads of said receive leadframes of the other of said rows of each ofsaid receive leadframe units; wherein said die-mounting pads of saidemitter leadframes of each of said emitter leadframe units arerespectively aligned with and spaced apart from said die-mounting padsof said receiver leadframes of an adjacent one of said receiverleadframe units in the second direction.
 11. The optoisolator leadframeassembly of claim 10, wherein each of said emitter leadframe unitsfurther includes at least one beam connected to said pair of rows ofsaid emitter leadframes.
 12. The optoisolator leadframe assembly ofclaim 11, wherein each of said emitter leadframe units includes acentral beam disposed between said pair of rows of said emitterleadframes and connected to said leads of said emitter leadframes. 13.The optoisolator leadframe assembly of claim 12, wherein said emitterleadframes of said pair of rows of each of said emitter leadframe unitsconnected to said central beam are disposed symmetrically.
 14. Theoptoisolator leadframe assembly of claim 11, wherein each of saidemitter leadframe units includes a pair of beams that are respectivelydisposed between said mounting pads and said leads of said emitterleadframes of said rows of said emitter leadframes, said leads of saidemitter leadframes of the one of said rows of said emitter leadframesdisposed alternately with said leads of said emitter leadframes of theother of said rows of said emitter leadframes.
 15. The optoisolatorleadframe assembly of claim 10, wherein each of said receiver leadframeunits further includes at least one beam connected to said two rows ofsaid receiver leadframes.
 16. The optoisolator leadframe assembly ofclaim 15, wherein each of said receiver leadframe units includes acentral beam disposed between said two rows of said receiver leadframesand connected to said leads of said receiver leadframes.
 17. Theoptoisolator leadframe assembly of claim 16, wherein said emitterleadframes of said two rows of each of said receiver leadframe unitsconnected to said central beam are disposed symmetrically.
 18. Theoptical leadframe assembly of claim 11, wherein each of said receiverleadframe units includes a pair of beams that are respectively disposedbetween said mounting pads and said leads of said receiver leadframes ofsaid rows of said receiver leadframes, said leads of said receiverleadframes of the one of said rows of said receiver leadframes disposedalternately with said leads of said receiver leadframes of the other ofsaid rows of said receiver leadframes.
 19. The optoisolator leadframeassembly of claim 11, wherein each of said emitter leadframe unitsinitially includes a free end portion that is connected to an endmostone of said emitter leadframes along the second direction opposite saidfirst rail and that is configured to be and is in overlapping contactwith said second rail.
 20. The optoisolator leadframe assembly of claim11, wherein each of said receiver leadframe units initially includes afree end portion that is connected to an endmost one of said receiverleadframes along the second direction opposite said second rail and thatis configured to be and is in overlapping contact with said first rail.